High-Speed Board-to-Board

Mezzanine systems with integral ground planes, high-density arrays, ExaMAX® backplane interconnects, rugged Edge Rate® systems and high-speed performance to 28+ Gbps.

• Mezzanine Strips
• Rugged High-Speed Strips
• High-Density Arrays
• Ultra Micro
• High-Isolation
• 28+ Gbps Solutions

Micro Pitch Board-To-Board

Interconnect systems with pitch availability as small as 0.40 mm and stack heights as low as 1 mm.

• .050" Systems
• Micro Rugged Board-to-Board
• Micro Pitch Systems
• Compression / One-Piece
• .050" x .100"
• Four Row High-Density

Rugged / Power

Power interconnects designed to meet high current applications, and micro rugged interconnects for high-reliability, high-retention and high cycle life.

• Micro Rugged Board-to-Board
• Power/Signal Systems
• Power Systems
• One-Piece Rugged & Power
• Extended Life Products

Edge Card Connector Systems

High-speed edge card interconnects on choice of 0.50 mm, 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm or 2.00 mm pitch and a variety of orientations.

• High-Speed Card Systems
• MSA Transceivers
• PCI Express®

Standard Board-To-Board

Board stacking interconnects for low profile, elevated, pass-through, and rugged applications on .100" (2.54 mm) and 2.00 mm pitch.

• .100" Pitch Square Post Sockets and Terminals
• 2.00 mm Pitch Sockets and Terminals
• PC/104-Plus™ Square Post Systems
• Screw Machine Strips
• Shunts and Jumpers

Backplane / Micro Backplane

ExaMAX® high-speed backplane system for 28 Gbps performance, and micro backplane solutions including edge card sockets, high-density arrays, integral ground planes and rugged Edge Rate® interconnects.

• High-Speed Backplane Systems
• Micro Backplane Systems