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云萨电子代理分销SAMTEC全系列产品。
High-Speed Board-to-Board
Mezzanine systems with integral ground planes, high-density arrays, ExaMAX® backplane interconnects, rugged Edge Rate® systems and high-speed performance to 28+ Gbps.
Micro Pitch Board-To-Board
Interconnect systems with pitch availability as small as 0.40 mm and stack heights as low as 1 mm.
Rugged / Power
Power interconnects designed to meet high current applications, and micro rugged interconnects for high-reliability, high-retention and high cycle life.
Edge Card Connector Systems
High-speed edge card interconnects on choice of 0.50 mm, 0.635 mm, 0.80 mm, 1.00 mm, 1.27 mm or 2.00 mm pitch and a variety of orientations.
Standard Board-To-Board
Board stacking interconnects for low profile, elevated, pass-through, and rugged applications on .100" (2.54 mm) and 2.00 mm pitch.
Backplane / Micro Backplane
ExaMAX® high-speed backplane system for 28 Gbps performance, and micro backplane solutions including edge card sockets, high-density arrays, integral ground planes and rugged Edge Rate® interconnects.